Try CircuitLens

Reference sheets

Via current

PCB via current capacity

Rough single-via guide from IPC-2221's own internal-conductor formula (I = 0.024 · ΔT0.44 · A0.725), treating the plated barrel as a trace of width π·d and thickness = the plating — assuming 25 µm of barrel plating (IPC-6012 Class 2's typical minimum is 20 µm) and a 10°C rise, no thermal relief. Real capacity depends on plating thickness, board stack-up, and ambient conditions; when a single via isn't enough, use several in parallel rather than assuming a bigger drill scales linearly — the exponent on area is 0.725, well short of linear.

More reference sheets